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CONTENTS Introduction 3D IC packaging 3D IC integration Potential applications of 3D IC integration Memory-chip stacking Wide I/O memory Wide I/O DRAM Wide I/O interface 2.5D IC integration (Passive Interposers) Xili /TSMC’ CWSXilinx/TSMC’s CoWoS Altera/TSMC’s CoWoS ITRI’s 2.5D IC integration Wf b i fC ill ith ldWafer bumping of Cu pillar with solder cap
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30 cm in diameter) can produce hundreds of these chips. There is a clear economic advantage to reduce the area of each IC, i.e., to reduce the size of devices and metal interconnects because the result is more chip per wafer and lower cost per chip. Since 1960, the world has made a huge investment in the planar micro-fabrication technology.
Description. Grinds alternating chip breaker slots in single pass (notch grinding) PLC controlled; Automatic shutdown upon completion of cycle; High Frequency air cooled electro-spindle allows for Variable grinding wheel speeds from 0- 50,000 rpm
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Emerging IC Packaging Technologies ... How the chip is attached Amkor Confidential Information 5 Dec-12, R.Huemoeller – 8.7mm die size in production, 11mm die size is qualified ... Profile & Integration : Wafer Level Fan Out Amkor Confidential Information 22 Dec-12, R.Huemoeller
Knowledge Base If you meet any unknown technical terms, do not hesitate to consult our glossary. From A like “analog” to Y like “yield” - fined detailed explanations of the most used technical terms.
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